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Monday 23 December 2024
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CIBUS TEC – FOOD PACK 2014 – Already sold out thanks to new exhibition sections

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PARMA, Italy – Cibus Tec,the International Exhibition on Technologies and Solutions for the Food Industry, is already sold out and opens new halls.

All exhibition areas are growing. Chief Technology Officers of the largest food companies from all over the world will participate at Cibus Tec. A rich program of events and conferences are scheduled on the agenda.

Over 500 Chief Technology Officers from all around the world have already registered in the incoming program managed by a steering committee made up of company leaders.

All main historical exhibitors of Cibus Tec – leaders of food processing – have already applied – including GEA, CFT, JBT, CMT, REDA, BUHLER.

The new section “Tecno Meat” is growing rapidly and hosts many companies including Treif, Vemag, Soncini, Frigomeccanica and Risco but remarkable is the attendance to Cibus Tec -Food Pack of several food packaging key players such as Tetra Pak, Aetna Group, Cavanna Packaging Group, Goglio, Ilpra, Multivac, Pfm, Sacmi, Sig,Ulma.

There are 5 months left to Cibus Tec, the reference point of food technologies for over 70 years, and these are the results scored by Fiere di Parma. This growth is thanks to a clear strategy focused on selected target markets and on a system of strategic partnerships with major industry associations.

In this context, in fact,Food Pack is running. It’s a recent joint venturewithUcima–Italian Packaging Machinery Manufactures Association – and the partnership withAssocarni – a member of Confindustria andFederalimentare – theonly one to representthe industry ofmeatfrom all supply chain (slaughtering, processing and transformation).

Cibus Tec – Food Pack will be an excellent opportunity to show both Italian and foreign customers the top of ours productions – said Riccardo Cavanna, CEO of Cavanna Packaging Group and VP of UCIMA. In addition, thanks to a careful selection of international customers, we could focus our attention to spread the culture linked to the Italian food and its capital food Parma.

If Cibus Tec – Food Pack is already changing the geography of exhibitions dedicated to the technologies of the agro-food sector, it is also thanks to the strategic agreement between Fiere di Parma and Koelnmesse, second exhibition centre in the world, that provides an extraordinary opportunity: the huge audience of food companies participating at Anuga and Cibus, respectively the first and the third food exhibitions in the world.

Our event – said Fabio Bettio,Cibus Tec – Food PackBrand Manager – is a highly specialized vertical trade fair thatwill place the technology at the heart of the whole supply chain in all the different production steps: sorting, processing , packaging, logistics, storage and distribution.

All this system allows a unique exhibition offer thatcould satisfy the needs of the food industries, that visiting Cibus Tec – Food Pack, will be able to find the best technologies and solutions.

Cibus Tec – Food pack is not only a trade exhibition, but it’s a complete platform to serve all sector players. Cibus Tec -Food Pack will offer a rich program of conferences that focuses on the next challenges of food industry: food safety, food waste, sustainability, logistics, and new innovations of packaging solutions.

Important contributions will come from the “EHEDG World Congress on Hygienic Engineering and Design”which will take place on 30 and 31 October and from “Tech Agrifood: Euromediterranean Business Meetings’, a rich program of meetings and B2Bs dedicated to fruit and vegetables, wine, cereal and oil industries.

To enrich the program, it will be three evening lectures about key topics dedicated to agro-food sector: bio-plastics, single serve coffee and drink and new trends of digital printing.Furthermore, workshops onprocessing tomato, ready-meals, fresh cut, milk and dairy products are other interesting opportunities for an in-depth analysis.

Cibus Tec – Food Pack international business matching will be focused on high potential areas like North America, Russia, East Europe, South America, China, India and “Next 11” countries.

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